Possibilities of multitouch functionality

With the touch-screen sector now entering a new phase of innovation, the issue of applying multitouch operation to the larger format displays found in industrial and public use settings is becoming a key engineering concern. Designers must examine the sensor technology options available today and consider using new single-layer project capacitive sensing technology to enable sophisticated human-machine interactions in large displays destined for harsh environments.

Multitouch sensor technology has the potential to revolutionize the way we connect with all manner of electronics hardware, giving touch-screen-based Graphical User Interfaces (GUIs) the ability to recognize complex gestures using several fingers such as rotating, two-digit scrolling, three-digit dragging, and pinch zoom, as well as allowing multiple users to collaborate. Analyst firm Markets & Markets predicts that the global multitouch business will reach $5.5 billion by 2016 (constituting more than 30 percent of the total touch panel market by this stage). The multitouch segment is currently exhibiting a compound annual growth rate of more than 18 percent, with the portable consumer sector driving the vast majority of this growth.

Moving forward, the problem for design engineers is knowing how to bring the multitouch capabilities that are already becoming commonplace in smartphones and tablet PCs to other areas that could also derive benefit from them. Digital signage, Point-Of-Sale (POS), public information, and industrial control systems could profit greatly from this sort of functionality. However, certain obstacles are inhibiting the adoption of multitouch in these nonconsumer sectors.

refer:
http://embedded-computing.com/articles/expanding-possibilities-multitouch-functionality/#at_pco=cfd-1.0

Great AR-V6005 and AR-V6100 in 2012 to make your business smarter

Acrosser In-Vehicle PC, AR-V6100 & AR-V6005 have been selected as the winner of 21th Taiwan Excellence Award. This award delivered by the Ministry of Economic Affairs (MOEA) and Taiwan External Trade Development Council (TAITRA), to encourage Taiwan industries to upgrade and incorporate innovations into their new products.

 AR-V6005 & AR-V6100 also support the optional GPS/GPRS/WiFi module inside one compact system, to fulfill the highly demand from telematic applications. In addition, Acrosser In-Vehicle PC has excellent mechanical design to adapt high environment endurance that is certified to operate under Vibration 3G (follow IEC60068-2-64) and shock 50G 11ms (follow IEC60068-2-27), and fully compliant with in-vehicle computer application such as E -Mark Certification (E-13).

Intel HM76 mobile chipset and FCPGA 988 socket for 3rd generation Core i

 in-vehicle computer AIV-HM76V0FL features Intel HM76 mobile chipset and FCPGA 988 socket for 3rd generation Core i mobile computer platform.

AIV-HM76V0FL adopts Acrosser’s expertise of design for in-vehicle applications. These designs include smart power management, high efficient thermal module, and diversity of integrated communication technology such as 4 USB 3.0, CAN bus, Wi-Fi, 3.5G wireless WAN, Bluetooth and GPS.

AIV-HM76V0FL Features
‧ FCPGA 988 socket support Intel 3rd Generation Core i7/i5 and Celeron processors up to 45W i7-3820QM
‧ Fanless thermal design and anti-vibration industrial design
‧ HDMI/DVI/VGA video outputs
‧ Combo connector for Acrosser’s In-Vehicle monitor
‧ 4 external USB 3.0 ports
‧ CAN bus 2.0 A/B
‧ Wi-Fi, Bluetooth, 3.5G, GPS
‧ One-wire (i-Button) interface
‧ 9-32 VDC power input
‧ -20 to 60 degree C operating temperature

The AR-R6006 carrys Intel ATOM dual-core D525 processor

The platforms is equipped with six Intel PCI express Gigabit Ethernet controllers. Its advanced features include 802.1p (QoS), 802.1q (VLAN), IPv4 and IPv6 checksum offload, auto MDI-X, up to 256 KB TCP segmentation, ACPI power saving control and 9 KB Jumbo Frame support. Customers can benefit much higher communication performance from AR-R6006.

AR-R6006 is a rackmount platform designed for Networking Application, which can be installed in the 19” rack. Both of the platforms offer the best cost/performance ratio in applications like the UTM, IDS/IPS, VPN, Firewall, Anti-Virus/Spam, RSA gateway, QoS, streaming. 

The AR-R6006 carrys Intel ATOM dual-core D525 processor which supports Hyper Threading Technology and Intel 64 architecture with low power consumption. Enhanced low-power states allow designers to further minimize overall power consumption. They can deliver more efficient use of processor resources, higher processing throughput and improved performance on applications.


Key features:
‧ 1U Rack Mount chassis
‧ Low power Intel ATOM D525 Dual Core processor 1.8 GHz+ ICH8M
‧ Two DDR3 SO-DIMM support up to 4GB (unbuffered and non-ECC dimm)
‧ 6 x Intel 82574L GbE Ethernet with 2 pair LAN Bypass Function
‧ 1 x 2.5”/3.5” SATA HDD Bay, 1 x CF Type II socket
‧ 2 x USB 2.0 ports in front
‧ 1 x Mini-PCI slot, 1 x RJ45 for Console

Slim Mainboard carry Intel Atom D2550 1.86GHz

 

Acrosser Technology Co. Ltd, global professional industrial and embedded computer provider, announces the new Mini-ITX mainboard, AMB-D255T1, which carries the Intel dual- core 1.86GHz Atom Processor D2550. AMB-D255T1 features powerful graphic performance via VGA and HDMI, DDR3 SO-DIMM support, mSATA socket with USB signals and SIM slot, and a DC jack for easy power in. AMB-D255T1 also provides complete I/O such as 4 x COM ports, 6 x USB2.0 ports, 1 x GbE RJ-45 port, 1 x SATA port with power connector.

．Intel Atom D2550 1.86GHz
．1 x DDR3 SO-DIMM up to 4GB
．1 x VGA
．1 x HDMI
．1 x 24-bit LVDS
．6 x USB2.0
．4 x COM
．1 x GbE (Realtek RTL8105E)
．1 x PS/2 KB/MS
．1 x MiniPCIe slot
．1 x SATA with power connector
．8-bit GPIO

 

 

Increase your storage and networking capacity seamlessly

The Intel® Xeon® processor E3-1200 v2 product family offers up to 32% more energy efficient performance than previous generation Intel® Xeon® processor-based servers.
A number of technologies have been added or upgraded to improve I/O bandwidth, gain faster access to commonly used programs and files, allow applications to run faster, increase data throughput, and improve the performance of disc-intensive retrieval applications.
The Intel® Xeon® processor platform is built for all day, every day reliability. Centralized data backup and critical security updates further help reduce the risk of costly downtime.
The Intel® Xeon® processor E3-1200 platform, which supports 20 I/O ports—up from 16, gives you the reliability you need today with plenty of room to grow for tomorrow. Increase your storage and networking capacity seamlessly.

from
http://www.intel.com/content/www/us/en/processors/xeon/xeon-processor-e3-family.html

COM Express Basic Type 6 Product with Great-Performance for Industrial Automation Application

COM Express Basic Type 6 Module, the ACM-B6360. ACM-B6360 features Intel 3rd generation FCBGA1023 Core i7 processor with QM77 platform, two DDR3-1333 SO-DIMM with ECC and providing great computing and graphic performance. Which is suitable for Industrial Automation and Entertainment applications.

ACM-B6360 is base on COM Express Type 6 pin-out design and supports two DDR3-1333 SO-DIMM socket with ECC and four native USB 3.0 ports. Working with Acrosser evaluation basboard ACM-B4080. It provides not only speed and but also reliability. Moreover, two SATA 3.0, two SATA 2.0, four USB 3.0, four USB 2.0, one GbE and I2C, SMBus interface are integrated on them. Even with great computing and graphic performance, the optimized power design delivers high power efficiency and decrease system heat.

The ACM-B6360 carries on board Intel 3rd gnenration Core i7-3615QE FCBGA1023 processor which supports three independent display with multiple output : 24-bit LVDS, VGA, HDMI and one DDI interface. One PCI-E x16 Gen., 3.0 and seven PCI-Ex1 interfaces for IO expansion. It is suitable for Medical, Test & Measurement and Transportation applications.